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Zero-G Devices
Symbol | Description | Test Number | Sample Size | Lot Size | Acceptance Criteria | Test Method |
---|---|---|---|---|---|---|
THB or HAST | Temperature-Humidity- Bias or Biased HAST | A2 | 77 | 3 | 0 Fails | JEDEC JESD22-A101 or A110 |
AC or UHST or TH | Autoclave or Unbiased HAST or Temperature- Humidity (without Bias) | A3 | 77 | 3 | 0 Fails | JEDEC JESD22-A102, A118, or A101 |
TC | Temperature Cycling | A4 | 77 | 3 | 0 Fails | JEDEC JESD22-A104 and Appendix 3 |
HTSL | High Temperature Storage Life | A6 | 45 | 1 | 0 Fails | JEDEC JESD22-A103 |
Testing Group A
Symbol | Description | Test Number | Sample Size | Lot Size | Acceptance Criteria | Test Method |
---|---|---|---|---|---|---|
HTOL | High Temperature Operating Life | B1 | 77 | 3 | 0 Fails | JEDEC JESD22-A108 |
ELFR | Early Life Failure Rate | B2 | 800 | 3 | 0 Fails | AEC Q100-008 |
Testing Group B
Symbol | Description | Test Number | Sample Size | Lot Size | Acceptance Criteria | Test Method |
---|---|---|---|---|---|---|
WBS | Wire Bond Shear | C1 | 30 bonds from a minimum of 5 devices | 30 bonds from a minimum of 5 devices | CPK > 1.67 | AEC Q100-001 AEC Q003 |
WBP | Wire Bond Pull | C2 | 30 bonds from a minimum of 5 devices | 30 bonds from a minimum of 5 devices | CPK >1.67 or 0 Fails after TC (test #A4) | MIL-STD883 Method 2011 AEC Q003 |
SD | Solderability | C3 | 15 | 1 | per J-STD-002 | JEDEC J-STD-002 |
PD | Physical Dimensions | C4 | 10 | 3 | CPK >1.67 | JEDEC JESD22-B100 and B108 AEC Q003 |
SBS | Solder Ball Shear | C5 | 5 balls from a min of 10 devices | 3 | Cpk >1.67 | AEC Q100-010 AEC Q003 |
Testing Group C
Symbol | Description | Test Number | Sample Size | Lot Size | Acceptance Criteria | Test Method |
---|---|---|---|---|---|---|
EM | Electromigration | D1 | --- | --- | --- | --- |
TDDB | Time Dependent Dielectric Breakdown | D2 | --- | --- | --- | --- |
HCI | Hot Carrier Injection | D3 | --- | --- | --- | --- |
BTI | Bias Temperature Instability | D4 | --- | --- | - | --- |
SM | Stress Migration | D5 | --- | --- | --- | --- |
Testing Group D
Symbol | Description | Test Number | Sample Size | Lot Size | Acceptance Criteria | Test Method |
---|---|---|---|---|---|---|
HBM | Electrostatic Discharge Human Body Model | E2 | See Test Method | 1 | Target: 0 Fails 2KV HBM (Classification 2 or better) For ? 28nm or RF operating frequency: 1KV HBM (Classification 1C or better) | AEC
Q100-002 |
CDM | Electrostatic Discharge Charged Device Model | E3 | See Test Method | 1 | Target: 0 Fails Test Condition 750 corner pins, Test Condition 500 all other pins (Classification C2A or better) For ? 28nm or RF operating frequency: Test Condition 250 (Classification C1 or better) | AEC
Q100-011 |
LU | Latch-Up | E4 | 3 | 1 | 0 Fails | AEC
Q100-004 |
ED | Electrical Distributions | E5 | 30 | 3 | Where applicable, CpK > 1.67 | AEC
Q100-009
AEC Q003 |
Testing Group E
Automotive-Grade Qualification
Up-screened automotive-grade parts are qualified per AEC-Q100 standards and test flows. The applicable test methods are outlined below. These qualification tests are not applicable for up-screened products from commercial processes.
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